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DIRECT THERMAL EXCHANGE

Direct Thermal Exchange (DTE) is a new PCB construction methodology that has been developed to achieve highly-efficient heat removal or thermal dissipation. This paper presents Direct Thermal Exchange (DTE) as a technology solution to the current limitations of thermally conductive dielectric when used in thermal management (heat dissipative) designs for high-power circuits (LED, Wireless, Microwave) in Printed Circuit Board (PCB) designs.

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